The Package separation process involves singulating resin-encapsulated boards into individual pieces.

We employ blade dicing, router-based separation, and press separation methods.

Blade Dicing: A high-speed rotating circular blade cuts integrated circuits attached to an adhesive sheet, separating them into individual pieces. Both wet and dry methods are supported.
Router-Based Separation: A high-speed rotating router bit tool cuts along V-grooves or perforations in the board to separate individual pieces. Also known as a PCB separator or PCB depaneling machine.
Press Separation: Uses a die equipped with blades positioned to match the board’s division points, pressing to separate the pieces.
We carefully select the optimal jigs, tools, and cutting conditions based on the board material and thickness. By doing so, we minimize chipping, cracks, and burr formation around the cutting areas and provide high-precision dicing services tailored to customer needs.

Additionally, we support half-cut processing using the blade dicing method.
We also accommodate small-lot processing, starting from a single board.
Feel free to contact us for further inquiries.

The board materials compatible with SME’s board separation technology include copper frames, PCB, HTCC, and LTCC.

For blade dicing, we can handle board sizes mounted on an 8-inch ring.

Experienced operators use stereomicroscopes and metallurgical microscopes to visually inspect for chipping and cracks around the board cutting area.
Additionally, we also support dimensional measurement using metallurgical microscopes.