COMPANY
Company Overview

Company Overview
- Company Name
- Shimane Masuda Electronics Co., Ltd.
- Address
- 320-97 Musocho, Masuda City, Shimane Prefecture, 698-2144, Japan MAP
- Phone / Fax
- +81-856-28-8100 / +81-856-28-8102
- CEO
- Futoshi Hiratani
- Founded
- August 1, 1984
- Capital
- 100 million yen
- Employees
- 118 (as of April 2024)
- Business Activities
- Development and manufacturing of semiconductor-related products
Organization Chart


Company History
- 1980
-
1984
- Aug.
- Shimane Masuda Electronics Co., Ltd. was established with a capital of 10 million yen.
- Oct.
- Began operations as a Si semiconductor assembly and testing partner of Mitsubishi Electric.
-
1985
- Jun.
- Started of GaAs MES FET low-noise semiconductors production
- Oct.
- Increased capital to 12 million yen
-
1987
- Oct.
- Commencement of GaAs compound semiconductors production
- 1990
-
1993
- Aug.
- Increased capital to 15 million yen
-
1995
- Aug.
- Obtained ISO 9002 certification
-
1997
- Aug.
- Increased capital to 18 million yen
- 2000
-
2000
- Aug.
- Increased capital to 24.5 million yen
-
2001
- May
- Yuzuru Ishikawa was appointed as CEO
- Jun.
- Increased capital to 66 million yen
- July
- Built a new factory and relocated
Increased capital to 133.5 million yen, Commencement of module product production.
-
2002
- Apr.
- Full-scale entry into electronics manufacturing services
-
2003
- Apr.
- Commencement of MAP QFN package development
- Dec.
- Transitioned to ISO 9001:2000 certification
-
2004
- Mar.
- Obtained ISO 14001 certification
- Oct.
- Signed a Letter of Intent (LOI) with Applied Nanotech, Inc. (ANI)
-
2005
- Apr.
- Commencement of mass production of modules using 0402 size surface-mount components
- Oct.
- Commencement of products using carbon nanotubes(CNT) development
Signed a collaborative development agreement with Applied Nanotech, Inc. (ANI) to create products using CNT
-
2006
- Feb.
- Commencement of mobile phone assembly production/Commencement of security devices production
- Oct.
- Signed a licensing agreement with Applied Nanotech, Inc. (ANI) for the development of products using CNT
Exhibited products developed using CNT at Nanotech in Dallas
-
2007
- Mar.
- Commencement of 0.36mm thick MAP QFN products production
-
2008
- May
- Commencement of MEMS products production
- 2010
-
2010
- Apr.
- Commencement of production of hollow structure packaging for satellite broadcasting
- Jun.
- Commencement of production of sensor products
-
2012
- Jun.
- Commencement of production for GPS-LNA products
-
2013
- Jan.
- First time exhibiting at NEPCON Japan
- Mar.
- Established a local subsidiary, SMET CO., LTD, in Thailand
-
2014
- July
- Mass production commenced at SMET
- Oct.
- 30th Anniversary of the Company's Operations
-
2015
- July
- Obtained ISO 9001:2008 certification at SMET through a multi-site approach
-
2016
- Sep.
- Established a Kanto Area Sales Office
- Oct.
- Commencement of IoT innovation project
- Nov.
- Signed a Product Supply Agreement with Nest Labs, Inc.
-
2017
- July
- Commencement of a pilot test for water level sensors in rivers under the IoT innovation project
- Sep.
- Obtained ISO/TS 16949 certification
- Dec.
- Commencement of shipments of products to Nest Labs, Inc.
-
2018
- Aug.
- Transitioned to ISO9001/ISO14001:2015 certification
- Sep.
- Transitioned to IATF16949:2016 certification
-
2019
- Oct.
- Futoshi Hiratani was appointed as CEO
- 2020
-
2021
- Oct.
- Commencement of product development utilizing wireless communication technology
-
2022
- Dec.
- Selection for the 8th Research Proposal Solicitation (RFP) by JAXA
-
2024
- Oct.
- 40th Anniversary of the Company's Operations





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