写真

Company Overview

Company Name
Shimane Masuda Electronics Co., Ltd.
Address
320-97 Musocho, Masuda City, Shimane Prefecture, 698-2144, Japan MAP
Phone / Fax
+81-856-28-8100 / +81-856-28-8102
CEO
Futoshi Hiratani
Founded
August 1, 1984
Capital
100 million yen
Employees
118 (as of April 2024)
Business Activities
Development and manufacturing of semiconductor-related products

Organization Chart

組織図 組織図

Company History

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  • 1980
  • 1984
    Aug.
    Shimane Masuda Electronics Co., Ltd. was established with a capital of 10 million yen.
    Oct.
    Began operations as a Si semiconductor assembly and testing partner of Mitsubishi Electric.
  • 1985
    Jun.
    Started of GaAs MES FET low-noise semiconductors production
    Oct.
    Increased capital to 12 million yen
  • 1987
    Oct.
    Commencement of GaAs compound semiconductors production
  • 1990
  • 1993
    Aug.
    Increased capital to 15 million yen
  • 1995
    Aug.
    Obtained ISO 9002 certification
  • 1997
    Aug.
    Increased capital to 18 million yen
  • 2000
  • 2000
    Aug.
    Increased capital to 24.5 million yen
  • 2001
    May
    Yuzuru Ishikawa was appointed as CEO
    Jun.
    Increased capital to 66 million yen
    July
    Built a new factory and relocated
    Increased capital to 133.5 million yen, Commencement of module product production.
  • 2002
    Apr.
    Full-scale entry into electronics manufacturing services
  • 2003
    Apr.
    Commencement of MAP QFN package development
    Dec.
    Transitioned to ISO 9001:2000 certification
  • 2004
    Mar.
    Obtained ISO 14001 certification
    Oct.
    Signed a Letter of Intent (LOI) with Applied Nanotech, Inc. (ANI)
  • 2005
    Apr.
    Commencement of mass production of modules using 0402 size surface-mount components
    Oct.
    Commencement of products using carbon nanotubes(CNT) development
    Signed a collaborative development agreement with Applied Nanotech, Inc. (ANI) to create products using CNT
  • 2006
    Feb.
    Commencement of mobile phone assembly production/Commencement of security devices production
    Oct.
    Signed a licensing agreement with Applied Nanotech, Inc. (ANI) for the development of products using CNT
    Exhibited products developed using CNT at Nanotech in Dallas
  • 2007
    Mar.
    Commencement of 0.36mm thick MAP QFN products production
  • 2008
    May
    Commencement of MEMS products production
  • 2010
  • 2010
    Apr.
    Commencement of production of hollow structure packaging for satellite broadcasting
    Jun.
    Commencement of production of sensor products
  • 2012
    Jun.
    Commencement of production for GPS-LNA products
  • 2013
    Jan.
    First time exhibiting at NEPCON Japan
    Mar.
    Established a local subsidiary, SMET CO., LTD, in Thailand
  • 2014
    July
    Mass production commenced at SMET
    Oct.
    30th Anniversary of the Company's Operations
  • 2015
    July
    Obtained ISO 9001:2008 certification at SMET through a multi-site approach
  • 2016
    Sep.
    Established a Kanto Area Sales Office
    Oct.
    Commencement of IoT innovation project
    Nov.
    Signed a Product Supply Agreement with Nest Labs, Inc.
  • 2017
    July
    Commencement of a pilot test for water level sensors in rivers under the IoT innovation project
    Sep.
    Obtained ISO/TS 16949 certification
    Dec.
    Commencement of shipments of products to Nest Labs, Inc.
  • 2018
    Aug.
    Transitioned to ISO9001/ISO14001:2015 certification
    Sep.
    Transitioned to IATF16949:2016 certification
  • 2019
    Oct.
    Futoshi Hiratani was appointed as CEO
  • 2020
  • 2021
    Oct.
    Commencement of product development utilizing wireless communication technology
  • 2022
    Dec.
    Selection for the 8th Research Proposal Solicitation (RFP) by JAXA
  • 2024
    Oct.
    40th Anniversary of the Company's Operations

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