The resin encapsulation process involves sealing and encasing integrated circuits, which have completed wire bonding, in resin. This process serves to protect the integrated circuits and wires from physical shock, contamination, and oxidation caused by moisture, providing protection from external factors.

There are solid and liquid types of encapsulants. Solid-type encapsulants are used in a molding process called transfer molding, which is similar to injection molding. In transfer molding, the encapsulant is heated and softened before being pressed into a mold, where it cools and solidifies to form the shape. Liquid-type encapsulants are used in a process called potting, where liquid resin is applied to the substrate and then heat-cured.

With our years of experience in resin molding technology, we consider factors such as adhesion to integrated circuits and substrates, heat resistance, heat dissipation, coefficient of thermal expansion, and mechanical strength to meet the diverse needs of our customers.

The substrates that can be handled with SME’s resin encapsulation technology include printed circuit boards (PCBs), flexible printed circuits (FPC), lead frames, and ceramic substrates. The resin thickness we can accommodate starts from 0.3mm. We also support partial encapsulation and can perform potting using dispensers. In addition to resin encapsulation, we can also provide sealing with lids (metal or resin). Encapsulation with special materials is also possible, so please feel free to contact us for any inquiries.

We provide various evaluations, including the observation of voids and cracks through planar grinding. Additionally, we offer ultrasonic deep flaw inspection (SAT), a non-destructive testing method, through our partner companies.

We use grinding equipment to polish the resin surface, and provide observation, photography, and measurement services. We also perform void inspection inside the resin. By physically exposing the cross-section of the sample, we can observe fine anomalies that are difficult to detect with non-destructive testing, as well as the internal structure of components that cannot be penetrated by X-rays.