Our underfill technology is capable of filling gaps as small as 45μm or less between the integrated circuit and the substrate. Additionally, we can precisely control the application of the underfill to prevent it from flowing up onto the surface of the integrated circuit.

We also provide partial underfill services, such as applying underfill to solder joints of passive components like resistors and capacitors, ensuring that specific areas are addressed as needed.

We offer various evaluations, including the observation of voids through cross-section polishing. Additionally, in collaboration with our partner companies, we provide non-destructive testing, such as ultrasonic deep crack testing (SAT).

We use a grinding system to slice the cross-section of the junction between the integrated circuit and the substrate for observation, photography, and measurement. We check for bonding defects such as voids in the underfill. By physically exposing the cross-section of the sample, we can observe fine abnormalities that are difficult to detect with non-destructive testing and examine the internal structure of components that X-rays cannot penetrate.