Our die bonding technology is capable of handling semiconductor elements as small as 0.15mm in diameter. The die bonding materials we handle include silver paste, insulating adhesives, metal sintered materials, and DAF (Die Attach Film). We also offer stack bonding and die bonding on both sides of the substrate.
Other materials are also available upon request.

We offer semiconductor device and substrate bonding strength testing using a bonding tester, cross-sectional observation of the bonding area through polishing, and void observation via X-ray inspection.

The tool attached to the load sensor descends until it reaches the surface of the substrate, at which point the device detects the substrate surface and stops the descent. The tool then rises to a preset height above the detected surface, and the load applied at the point of breaking during the bonding is measured.

Using a polishing device, we grind the cross-section of the joint between the semiconductor device and the substrate for observation, imaging, and measurement. We check for any bonding defects such as cracks or voids.

Since the cross-section of the sample is physically revealed, it allows us to observe minute abnormalities that are difficult to detect with non-destructive testing methods, as well as inspect the interior of components that cannot be penetrated by X-rays.