In order to satisfy our customers' needs, we utilize the following manufacturing processes and methods to give shape to our customers' ideas.
Connector mounting
Surface Mount Technology (SMT) type only
Wire Bonding
Material：Al
Wire diameter：100μm-500μm
Surface Mount Technology
Component size：0402 and above
Die Bonding
Chip material：Si/GaAs/SiC
Wire Bonding
Material：Au
Wire diameter：18μm-30μm
Flip Chip
Mounting method：C4
Encapsulation
Encapsulation material：Epoxy-based
QFN (Quad Flat No-lead) component mounting
Pin pitch：0.35mm and above
WL-CSP (Wafer Level Chip Scale Package) mounting
Ball pitch：200μm and above
Connection with FPC (Flexible Printed Circuit)
IC and FPC connection via wire bonding
| Package size（㎜） | Number of chips | Number of componentsBo |
|---|---|---|
| □3.0～□8.0 | ～7 | ～70 |
Assembly of sizes other than the above is also possible.
We will support development based on your desired package specifications, so please feel free to consult with us.
| Package size（mm） | Number of leads (pin) |
Pin pitch (mm) |
Chip size (mm) |
|
|---|---|---|---|---|
| BODY SIZE | t | |||
| □1.5 | 0.4 | 6 | 0.4 | 0.8 ｘ 0.4 |
| 0.6 | ||||
| 0.9 | ||||
| □2.0 | 0.4 | 10 | 0.4 | 1.0 ｘ 0.9 |
| 0.6 | ||||
| 0.9 | ||||
| □2.5 | 0.4 | 16 | 0.5 | 1.4 ｘ 1.4 |
| 0.6 | ||||
| 0.9 | ||||
| □3.0 | 0.4 | 16 | 0.5 | 1.6 ｘ 1.6 |
| 0.6 | ||||
| 0.9 | ||||
| □4.0 | 0.9 | 24 | 0.5 | 2.7 ｘ 2.7 |
| □5.0 | 0.9 | 28 | 0.5 | 3.5 ｘ 3.5 |
| □5.5 | 0.9 | 40 | 0.4 | 4.0 ｘ 4.0 |
| □6.0 | 0.9 | 40 | 0.4 | 3.5 ｘ 3.5 |
| □7.2 | 0.9 | 52 | 0.4 | 4.7 ｘ 4.7 |
Assembly of sizes other than the above is also possible.
We will support development based on your desired package specifications, so please feel free to consult with us.
There are no standard products, but assembly is possible.
We will support development based on your desired package specifications, so please feel free to consult with us.
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